Embedded Chips


BGA package flash memory, where BGA is the abbreviation of "Ball Grid Array", that is, ball grid array packaging technology, which is the use of ball grid array contact communication. The contact is located at the bottom of the chip. The number of common contacts are 132 or 152. The SMT is soldered by the controlled collapse chip method, which improves its electrical and thermal properties, and the assembly can be co-planar soldered, making it much more reliable. 

For future PCIE 4.0 SSDs, higher transfer rates can only be achieved with BGA packages. In the future, all flash memory in BGA packages will be used in both the consumer and enterprise sectors, instead of TSOP package. 


  • Laptop
  • Smartphone
  • Solid State Drives


Dimension 16.00× 20.00×1.4mm
Max. Sequential Read 470MB/s
Max. Sequential Write 350MB/s
Density 32GB ~ 512GB
Approved verification platform Qualcomm, MediaTek, Intel
Operating voltage VCC=3.3v,VCCQ =1.8v, VCCK=1.1 V
Operating temperature Consumer grade:-20℃~70℃
Industrial grade:-40℃~85℃
Packaging FBGA157

About us

  • Krystaic Technology
  • Professional Manufacturer
  • Main Business

Jingtai Integrated Circuits Co., Ltd is BGA132s Suppliers and OEM BGA132 Factory, Krystaic is a semiconductor company serving the global semiconductor packaging, testing and manufacturing services. For a long time, we have insisted on technological innovation, focusing on the research and development of advanced semiconductor process technology and the assembly of end products.

With more than 15 years of industry experience and a professional R&D team, Krystaic is actively involved in domestic substitution and the development and manufacture of Cintron's independently controllable products. At the same time, we cooperate closely with domestic and foreign suppliers and introduces advanced equipments from Japan. While enhancing product functions and reducing costs, we are committed to providing global customers with safe and reliable solutions, reasonable prices, efficient and fast semiconductor testing and manufacturing services. We have through ROHS, ISO9001, BSCI, CE and other system certifications. Our company is a high-tech company that attaches great importance to quality, research, development, technology and humanistic spirit.

Krystaic has accumulated 15 years of experience in the storage industry and has long been committed to developing and manufacturing automatic control products to replace imports. It is the only manufacturer in Taizhou that can produce storage product modules. Our main business includes memory chip assembling, SSD mass production and SMT chip processing,etc. SMT accuracy can be as low as 01005. We have experience in installing CMOS sensors on FPC soft boards. At present, the monthly assembling capacity of our company can reach 6kk (million), and the module is 3 ~ 4kk. Our main products include USB flash disk, solid state drive, Micro SD card, general flash memory, etc. Our products are widely used in computer, communication, home appliances, set-top box, it digital and other high-tech industries.

Of Experience

SMT accuracy down to


Monthly assembling capacity


Monthly module capacity

Why Choose Us



We have 15 years of industry experience, a professional production team, and long-term cooperation with professional solution companies.


Cost and Efficiency

We have four own processing plants with high production efficiency, high quality and reasonable price.



Our Quality Control Department use advanced testing equipments to ensure high quality mass production.



We produce SSD, BGA132, TF, UDP and other products, which can meet the packaging and assembly needs of customers of various types for particles.


Production Capacity

Our current monthly packaging capacity can reach 6KK (million) and module can reach 3 to 4KK, which can meet the needs of customers with different purchasing volume.



Our professional sales and R&D team will provide you with reasonable solutions.


Get in touch