Our History

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  • 2005

    Established Hong Kong company

  • 2006

    Became the largest TSOP packaging and testing facility in Shenzhen

  • 2007

    Established DIE Sorting department; became the second largest DIE testing factory in Shenzhen

  • 2009

    Signed a contract with RAMOS foundry, a subsidiary of Samsung Semiconductor

  • 2011

    Awarded RAMOS global best supplier

  • 2014

    Awarded the national high-tech enterprise

  • 2016

    Passed Apple MFI certification

  • 2017

    Established packaging plant and started production of TF, UDP and other memory chips

  • 2019

    Expanded the business from BGA memory chip packaging to finished SSD module production
  • 2020

    Breakthrough in stacked DIE technology, mass production of stacked DIE package chips
  • 2021

    Become the vice chairman unit of Zhejiang associating for IOT industry